Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11706851 | RF circuit and enclosure having a micromachined interior using semiconductor fabrication | Elizabeth T. Kunkee, Dah-Weih Duan, Chunbo Zhang, Greta S Tsai, Ming-Jong Shiau +2 more | 2023-07-18 |