Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828875 | Proximity sensor with integrated ALS | — | 2023-11-28 |
| 11742437 | WLCSP with transparent substrate and method of manufacturing the same | Yiying KUO | 2023-08-29 |
| 11585847 | Crack detection integrity check | Pedro Jr Santos PERALTA | 2023-02-21 |
| 11581280 | WLCSP package with different solder volumes | — | 2023-02-14 |
| 11581289 | Multi-chip package | Yong Chen | 2023-02-14 |
| 11562937 | Semiconductor package with protected sidewall and method of forming the same | Yun Liu | 2023-01-24 |