Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854853 | Wafer positioning method and apparatus | Chia-Cheng Chen, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo | 2023-12-26 |
| 11831094 | Electrical connector assembly including a back plate having a curved inner region and a flat outer region | SHAN-YONG CHENG | 2023-11-28 |
| 11776810 | Method of forming a semiconductor device | Chia-Cheng Chen, Chun-Hung Wu, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo +3 more | 2023-10-03 |
| 11690222 | Three-dimensional memory device | Tzung-Ting Han | 2023-06-27 |