Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2023-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735563 | Package-on-package assembly with wire bond vias | Ellis Chau, Reynaldo Co, Philip Damberg, Wei-Shun Wang, Se Young Yang | 2023-08-22 |