Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11693810 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, David W. Mendel, Dinesh Patil, Gary Brian Wallichs, Jakob Raymond Jones | 2023-07-04 |
| 11669479 | Multichip package with protocol-configurable data paths | Huy Ngo, David W. Mendel | 2023-06-06 |
| 11657016 | Distributed multi-die protocol application interface | Gary Brian Wallichs, Cora Lynn Mau | 2023-05-23 |