Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11663154 | Virtualized link states of multiple protocol layer package interconnects | Ting Lok Song, Mahesh Wagh, Su Wei Lim | 2023-05-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11663154 | Virtualized link states of multiple protocol layer package interconnects | Ting Lok Song, Mahesh Wagh, Su Wei Lim | 2023-05-30 |