YL

Yi-Jung Liu

IS Integrated Silicon Solution: 1 patents #1 of 5Top 20%
📍 Hsinchu, CA: #151 of 214 inventorsTop 75%
Overall (2023): #196,728 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11612965 Method of forming package structure Cheng-Fu YU, Kai-Jih SHIH 2023-03-28