Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710595 | Magnetic component structure with thermal conductive filler and method of fabricating the same | Yi-Ting Lai, Jen-Chuan Hsiao, Hsieh-Shen Hsieh | 2023-07-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710595 | Magnetic component structure with thermal conductive filler and method of fabricating the same | Yi-Ting Lai, Jen-Chuan Hsiao, Hsieh-Shen Hsieh | 2023-07-25 |