Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840914 | Multi-stage perforation and shock wave combined device and method for initial fracture enhancement | Tianqiao Mao, Xiao Li, Shouding Li, Yanzhi Hu, Bo Zheng | 2023-12-12 |