Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610817 | Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer | John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec, Daniel Pieber | 2023-03-21 |