Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562967 | Method for fabricating a semiconductor package, semiconductor package and embedded PCB module | Frank Daeche | 2023-01-24 |
RK
Richard Knipper
Overall (2023): #282,521 of 537,848Top 55%
1
Patents 2023