Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817418 | Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant | Wei Lee Lim, Run Hong Toh | 2023-11-14 |
PY
Peng Liang Yeap
Overall (2023): #296,051 of 537,848Top 60%
1
Patents 2023