Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809667 | Transparent conductive substrate structure used for thermoforming process | Sheng-Chieh Tsai, Yao-Zong Chen, Hsiou-Ming Liu | 2023-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809667 | Transparent conductive substrate structure used for thermoforming process | Sheng-Chieh Tsai, Yao-Zong Chen, Hsiou-Ming Liu | 2023-11-07 |