Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11753502 | Oligomer, composition, packaging structure, and method of disassembling packaging structure | Chi-Fu Tseng, Jauder Jeng, Tien-Shou Shieh | 2023-09-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11753502 | Oligomer, composition, packaging structure, and method of disassembling packaging structure | Chi-Fu Tseng, Jauder Jeng, Tien-Shou Shieh | 2023-09-12 |