Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Runsheng Mao, Sihai Chen, David Bedner | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581239 | Lead-free solder paste as thermal interface material | Ning-Cheng Lee, Runsheng Mao, Sihai Chen, David Bedner | 2023-02-14 |