Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824122 | Method for filling a space in a semiconductor | Boon Teik Chan, Waikin Li | 2023-11-21 |
| 11776841 | Buried power rail contact formation | — | 2023-10-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824122 | Method for filling a space in a semiconductor | Boon Teik Chan, Waikin Li | 2023-11-21 |
| 11776841 | Buried power rail contact formation | — | 2023-10-03 |