Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817250 | Broadside coupled coplanar inductors | Xin Zhang | 2023-11-14 |
| 11799374 | Vertical power delivery packaging structure | Xin Zhang, Yuan Yao | 2023-10-24 |
| 11799384 | Power converter with co-packaged secondary field effect transistors (FETs) | Xin Zhang, Andrew Ferencz | 2023-10-24 |
| 11792911 | Flexible cold plate for contacting varied and variable chip heights | Shurong Tian | 2023-10-17 |
| 11792954 | Dedicated airflow channels for cooling server drawers | Shurong Tian | 2023-10-17 |
| 11765849 | Daughter card plug detection | Stanley Eckert, Steven Louis Makow | 2023-09-19 |
| 11687148 | Stacked, reconfigurable co-regulation of processing units for ultra-wide DVFS | Robert K. Montoye, Kevin Tien, Yutaka Nakamura, Jeffrey H. Derby, Martin Cochet +1 more | 2023-06-27 |
| 11631635 | Flex prevention mechanical structure such as a ring for large integrated circuit modules and packages and methods of manufacture using same | Shurong Tian | 2023-04-18 |
| 11621212 | Backing plate with manufactured features on top surface | Yuan Yao, Shurong Tian | 2023-04-04 |