Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11755360 | Detecting layered bottlenecks in microservices | Yohei Ueda, Tatsuhiro Chiba, Marcelo Carneiro Do Amaral, Sunyanan Choochotkaew, Qi Zhang | 2023-09-12 |
| 11588651 | Blockchain timestamp agreement | Sachiko Yoshihama, Yohei Ueda, Kohichi Kamijoh, Hiroaki Nakamura | 2023-02-21 |