SS

Sri M. Sri-Jayantha

IBM: 3 patents #891 of 6,852Top 15%
📍 Ossining, NY: #19 of 84 inventorsTop 25%
🗺 New York: #1,255 of 11,993 inventorsTop 15%
Overall (2023): #60,293 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11817359 Warp mitigation using pattern-matched metal layers in organic substrates Hien Dang 2023-11-14
11570928 Server node connector mating condition health monitoring and reporting Hien Dang, Vijayeshwar D. Khanna 2023-01-31
11545415 Pressure controllable encapsulated liquid thermal interface Gerard McVicker 2023-01-03