Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810832 | Heat sink configuration for multi-chip module | Janak G. Patel, Manish Nayini, Nazmul Habib | 2023-11-07 |
| 11682646 | IC chip package with dummy solder structure under corner, and related method | Manish Nayini, Janak G. Patel, Nazmul Habib | 2023-06-20 |