Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11617260 | Multi-board mid-plane providing superior thermal performance, enhanced connector placement, and enhanced electrical signal trace routing channels | Ketan K. Patel, Sashi J. Vijayan, Wen Tien Wang, Po-Jen Huang, Shih-ming Wan +2 more | 2023-03-28 |