Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776876 | Distributing heatsink load across a processor module with separable input/output (I/O) connectors | Scott R. LaPree | 2023-10-03 |
| 11758664 | Processor module retention | Scott R. LaPree | 2023-09-12 |