AH

Andrew C. M. Hicks

IBM: 12 patents #89 of 6,852Top 2%
📍 Highland, NY: #1 of 13 inventorsTop 8%
🗺 New York: #132 of 11,993 inventorsTop 2%
Overall (2023): #6,022 of 537,848Top 2%
12
Patents 2023

Issued Patents 2023

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11853750 Subject matter expert identification and code analysis based on a probabilistic filter Robert Peter Catalano, Tyler Vezio Rimaldi, Daniel Nicolas Gisolfi 2023-12-26
11836060 System testing infrastructure with hidden variable, hidden attribute, and hidden value detection Kevin Minerley, Dale E. Blue, Ryan Thomas Rawlins, Daniel Nicolas Gisolfi 2023-12-05
11709936 Automatic integrity vulnerability detection in an integrated development environment Diane Marie Stamboni, Thomas W. Conti, Gregg M. Arquero, Joshua David Steen, Michael Page Kasper 2023-07-25
11669602 Management of securable computing resources Ryan Thomas Rawlins, Christopher V. DeRobertis, Khaalid Persaud Juggan McMillan 2023-06-06
11663113 Real time fault localization using combinatorial test design techniques and test case priority selection Ryan Thomas Rawlins, Dale E. Blue, Brian Mo 2023-05-30
11656869 Using big code to construct code conditional truth tables Michael E. Gildein, II, Daniel Nicolas Gisolfi 2023-05-23
11636028 Stress test impact isolation and mapping Ryan Thomas Rawlins, Dale E. Blue, Jacob Thomas Snyder 2023-04-25
11630663 Compressing multi-attribute vector into a single eigenvalue for ranking subject matter experts Robert Peter Catalano, Tyler Vezio Rimaldi, Daniel Nicolas Gisolfi 2023-04-18
11609842 System testing infrastructure for analyzing and preventing soft failure in active environment Ryan Thomas Rawlins, Dale E. Blue, Kevin Minerley 2023-03-21
11604713 Automated hardware for input/output (I/O) test regression apparatus Michael P. Lyons, Miles C. Pedrone, Tynan J. Garrett 2023-03-14
11593256 System testing infrastructure for detecting soft failure in active environment Ryan Thomas Rawlins, Dale E. Blue, Kevin Minerley 2023-02-28
11554546 Heated three-dimensional printer head for variable material deposition Miles C. Pedrone, Tynan J. Garrett, Michael P. Lyons 2023-01-17