TD

Tomoya DAIZO

IC Ibiden Co.: 1 patents #19 of 48Top 40%
Overall (2023): #224,827 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11622446 Wiring substrate Isao Ohno, Yoji Sawada, Kazuhiko Kuranobu 2023-04-04