Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792937 | Component built-in wiring substrate | Takahiro Yamada, Seiji Izawa | 2023-10-17 |
| 11749596 | Wiring substrate | Yoji Sawada | 2023-09-05 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792937 | Component built-in wiring substrate | Takahiro Yamada, Seiji Izawa | 2023-10-17 |
| 11749596 | Wiring substrate | Yoji Sawada | 2023-09-05 |