Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11748545 | Method and electronic device for configuring signal pads between three-dimensional stacked chips | Yu-Jung Huang, Tzu-Lun Yuan, Mei-Hui Guo | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11748545 | Method and electronic device for configuring signal pads between three-dimensional stacked chips | Yu-Jung Huang, Tzu-Lun Yuan, Mei-Hui Guo | 2023-09-05 |