Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756915 | Method and structure to control the solder thickness for double sided cooling power module | Myung Ill You | 2023-09-12 |
| 11721613 | Power module | Myung Ill You, Jin Myeong Yang | 2023-08-08 |