Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820884 | Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same | Jin Young Yoon, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong +2 more | 2023-11-21 |