Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11606397 | Server and operating method thereof | Sangil Ahn | 2023-03-14 |
| 11594503 | Wire bonding method for semiconductor package | Hosoo HAN | 2023-02-28 |
YL
Yongje Lee
Hyperconnect: 1 patents #5 of 19Top 30%
Overall (2023): #92,409 of 537,848Top 20%
2
Patents 2023