Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641072 | PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module | Weijian Pan, Dan Yang | 2023-05-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641072 | PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module | Weijian Pan, Dan Yang | 2023-05-02 |