JH

Junfu Hu

Huawei: 1 patents #1,187 of 3,461Top 35%
📍 Dongguan, CN: #200 of 556 inventorsTop 40%
Overall (2023): #379,764 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11823996 Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same Hamit Duran 2023-11-21