Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787126 | Bonding system and bonding method | Kenji Furuyashiki, Hiroshi Yuchi, Yoshinori Yamamori, Takayuki Mori, Yoshihiro Iwano +1 more | 2023-10-17 |
| 11780124 | Apparatus for manufacturing thermoplastic resin material | Yoshiaki Matsumoto, Shunya HATANAKA, Takashi Kusaka, Yasunari Kuratani | 2023-10-10 |