Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11660839 | Three-dimensional hierarchical layered porous copper and method for making the same | Lu-Zhuo Chen, Bin Li, Lin Zhu, Wen-Zhen Li | 2023-05-30 |
CL
Chen Luan
Tsinghua University: 1 patents #77 of 432Top 20%
Overall (2023): #487,328 of 537,848Top 95%
1
Patents 2023