Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735461 | Adhesive-layer structure and semiconductor structure | Yu-Yun Lo, Bo-Wei Wu, Shiang-Ning Yang | 2023-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735461 | Adhesive-layer structure and semiconductor structure | Yu-Yun Lo, Bo-Wei Wu, Shiang-Ning Yang | 2023-08-22 |