JM

Jun Mizuno

HI Harima Chemicals, Incorporated: 1 patents #1 of 8Top 15%
HI Hitachi: 1 patents #195 of 745Top 30%
TW The Japan Steel Works: 1 patents #8 of 45Top 20%
WU Waseda University: 1 patents #1 of 13Top 8%
Overall (2023): #73,145 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11785112 Job execution system, and job execution method Takahiro SAGARA 2023-10-10
11777469 Bonded substrate, surface acoustic wave element, surface acoustic wave element device, and bonded substrate manufacturing method Kouhei KURIMOTO, Kazuhito Kishida, Rinzo Kayano, Shoji Kakio 2023-10-03
11676935 Bonding method and structure Hiroyuki Kuwae, Kosuke Yamada, Masami Aihara, Takayuki Ogawa 2023-06-13