TI

Tetsurou Iwakura

RE Resonac: 1 patents #29 of 157Top 20%
📍 Tsukuba, JP: #59 of 247 inventorsTop 25%
Overall (2023): #232,478 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11827789 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof Aya Kasahara 2023-11-28