Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626336 | Package comprising a solder resist layer configured as a seating plane for a device | Kinfegebriel Amera Mengistie, Francesco Carrara, Chang-Ho Lee, Ashish Alawani, Mark A. Kuhlman +4 more | 2023-04-11 |