Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791178 | Compliant mechanical system for mini/micro chip mass transfer and packaging | Hui-Chi Tang, Zhishen Liao, Xin Chen, Jian Gao, Qiang Liu +1 more | 2023-10-17 |
| 11715655 | Flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer | Xin Chen, Hui-Chi Tang, Hongcheng Li, Jian Gao, Qiang Liu +1 more | 2023-08-01 |