Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11725294 | Methods for partial gold plating of metal packaging housings and packaging housings thereof | XIAO-MEI MA, Lei Yang, Huasan Chen, Zhengsheng Tang, Jin Sun +1 more | 2023-08-15 |
| 11545326 | Hot swap component and circuit breaking apparatus used with circuit breaker | Xiaofei Pu, Xiong Hu | 2023-01-03 |