Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11751333 | Overlap joint flex circuit board mating | John Martinis, Xiaojun Huang | 2023-09-05 |
| 11600588 | Superconducting bump bonds for quantum computing systems | Zhimin Jamie Yao | 2023-03-07 |