Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11757003 | Bonding wafer structure and method of manufacturing the same | Wei Wu, Hung-Chang Lo | 2023-09-12 |
| 11688628 | Method of manufacturing epitaxy substrate | Chih-Yuan Chuang, Chi-Tse Lee, Chun-I Fan, Wen-Ching Hsu | 2023-06-27 |
| 11588014 | Epitaxial structure | Jia-Zhe Liu, Yen-Lun Huang | 2023-02-21 |
| 11588015 | Epitaxial structure | Jia-Zhe Liu, Yen-Lun Huang | 2023-02-21 |