Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804440 | Chip module with robust in-package interconnects | Saquib B. Halim, Frank Kuechenmeister, Christian Goetze | 2023-10-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804440 | Chip module with robust in-package interconnects | Saquib B. Halim, Frank Kuechenmeister, Christian Goetze | 2023-10-31 |