Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610837 | Via structures of passive semiconductor devices | Benfu Lin, Bo Li, Chengang Feng, Yudi Setiawan, Yun Ling Tan | 2023-03-21 |
| 11545486 | Integrated thin film resistor and metal-insulator-metal capacitor | Chengang Feng, Yanxia Shao, Yudi Setiawan, Handoko Linewih | 2023-01-03 |