Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557421 | Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method | Frank G. Küchenmeister, Marcel Wieland, Hartmuth Daniel Kunze, Lothar Lehmann, Patrick Rohlfs | 2023-01-17 |