Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11561051 | Heat sink, board module, transmission device, and method of manufacturing the heat sink | Mitsuru Etou, Tomoyuki Hongoh, Ryo Matsumoto, Kazuhiko Ohta | 2023-01-24 |
YS
Yuji Shioya
Overall (2023): #187,232 of 537,848Top 35%
1
Patents 2023