Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11789218 | Three-dimentional packaging method and package structure of photonic-electronic chip | Yichen Shen, Samuel Jiang | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11789218 | Three-dimentional packaging method and package structure of photonic-electronic chip | Yichen Shen, Samuel Jiang | 2023-10-17 |