Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798871 | Device package substrate structure and method therefor | Chee Seng Foong, Tingdong Zhou | 2023-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798871 | Device package substrate structure and method therefor | Chee Seng Foong, Tingdong Zhou | 2023-10-24 |