Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631634 | Leadless semiconductor package and method of manufacture | Fei Ying Wong, Ringo Cheung, Billie Bi | 2023-04-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631634 | Leadless semiconductor package and method of manufacture | Fei Ying Wong, Ringo Cheung, Billie Bi | 2023-04-18 |