Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562948 | Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor package | You-Wei Lin | 2023-01-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562948 | Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor package | You-Wei Lin | 2023-01-24 |