Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823864 | Embedded high-Z marker material and process for alignment of multilevel ebeam lithography | Christopher David Bohn, Maxwell Choi, Melanie S. Yajima, Sieu Ha, Maggy Lau +2 more | 2023-11-21 |